Nexperia-Tata Deal Strengthens India’s Position in Global Chip Supply Chain

Dutch semiconductor company Nexperia has partnered with Tata Electronics to manufacture and package power control chips in India, following its dispute with former Chinese parent company Wingtech.

Under the partnership, the companies will manufacture a range of Nexperia’s power control chips at Tata Electronics’ planned $11 billion semiconductor facility in Dholera, Gujarat. They will also collaborate on chip assembly and testing at Tata’s packaging facility in Jagiroad, Assam.

The companies will work together on future semiconductor technologies as well, although financial details of the agreement were not disclosed.

The partnership will cover three key areas — front-end wafer fabrication, back-end assembly and testing, and technology and ecosystem development.

As part of the front-end collaboration, Nexperia and Tata Electronics are preparing for the production of Nexperia’s MOSFET portfolio at Tata Electronics’ upcoming 300mm semiconductor fabrication plant in Dholera.

Tata Electronics CEO Randhir Thakur said the partnership marks an important step towards building a globally competitive and integrated semiconductor manufacturing ecosystem in India.

Nexperia Interim CEO Stefan Tilger said the companies bring complementary strengths in technology, manufacturing and innovation, adding that the partnership would support the development of India’s semiconductor capabilities.

Nexperia supplies chips widely used in the automotive and consumer electronics sectors. The company became embroiled in a dispute with Wingtech in September 2025 after the Dutch government intervened to prevent the transfer of Nexperia’s operations to China.

China subsequently imposed temporary restrictions on exports of Wingtech’s chips packaged in Dongguan, contributing to supply disruptions for global automakers.

The latest partnership with Tata Electronics expands Nexperia’s manufacturing network in India while supporting efforts to develop domestic semiconductor production and packaging capabilities.